Laser Cutting and Routing Systems for The Depaneling of PCB, FPC

Basic Info.

Model NO.	SW-PLC
Applicable Material	Metal
Type	Flat-Plate
Laser Classification	Fiber Laser
Engraving Method	Vector Engraving
Certificate	CE, FDA
Term	Fob Shenzhen
Delivery	15 Working Days
Workbench	High Precision Linear Motor and Marble Platform
Features	Auto-Positioning Cutting PCB
Transport Package	Standard Eexport Wooden Packing
Specification	1.5CBM
Trademark	SUPERWAVE LASER
Origin	China
Production Capacity	100sets/Month

Product Description

Laser Cutting and Routing Systems for The Depaneling of PCB, FPC | Supuerwave ® Laser Depaneling is the most innovative and promising technique for cutting and separating printed circuit boards from the panel and is differentiated from the classic separation methods in particular by its flexibility and stress-free processing.
Features
1. High quality cutting edge of PCB & FPC: The narrow beam diameter of the laser enables precise and high quality processing of the PCB & FPC material.2. Sress-free processing: Due to the non-contact process, Laser separates the printed circuit boards from the panel without any mechanical stress to the material. 3. Keep clean processing: In mechanical processes, such as milling, dust is generated during the manufacturing process, while Laser depaneling evaporates the material, and at the same time, Fume extraction device exhausts the cutting fumes and keep the boards clean. 4. Materials diversity: Superwave Laser Depaneling can process a wide variery of different substrate materials with ease by varying the process parameters.
Technical Data

Laser model	SW-PCB
Laser power	10W / 15W / 20W
Working Area	200 x 300mm (Customization Accepted)
Laser wavelength	355±15nm
Max diameter of Focus beam	20μm
Repeatability	<=2μm
Laser pulse frequency	40 kHz to 300kHz
File format	.Gerber/. dxf /.plt /.jpg, etc
Fiber cable core diameter	<=2KW
Cooling system	Water chiller
Power supply	AC220V/50-60Hz
Options	Air compressor / Fume Exhaustion

Samples